Method for producing a multilayer printed circuit board, adhesion prevention material and multilayer printed circuit board and use of such a method
US8685196B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2010 |
| Grant date | Apr 1, 2014 |
| Priority date | — |
| Expiry date | Jun 15, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1066
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a method for producing a multilayer printed circuit board from a plurality of conducting or conductive and non-conducting or insulating layers or plies to be connected to each other, in particular to be pressed together, wherein after connecting at least partially planar layers at least a partial region (11) thereof is removed, and wherein in order to prevent adherence of the partial region (11) to be removed a material (8) preventing adhesion is applied in accordance with the partial region to be removed onto a layer (9) which adjoins the partial region to be removed, it is provided that the material (8) preventing adhesion is formed by a mixture comprising a release agent on the basis of at least one metal soap, preferably the fatty acid salts of Al, Mg, Ca, Na and Zn, a binding agent, and a solvent, whereby a partial region to be removed can be removed easily and reliably after appropriate treatment and/or processing steps of the multilayer printed circuit board. In addition, an adhesion prevention material and a use of the method in connection with the production of a multilayer printed circuit board (1) are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.