Integrated circuit system with contact distribution film
US8685861B2 · kind B2 · utility
0Cited by
12References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2006 |
| Grant date | Apr 1, 2014 |
| Priority date | — |
| Expiry date | May 31, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A integrated circuit system including providing an integrated circuit device, forming an undoped insulating layer over the integrated circuit device, forming a thin insulating layer over the undoped insulating layer, forming a doped insulating layer over the thin insulating layer, and forming a contact in the undoped insulating layer, thin insulating layer and the doped insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.