Patent · US Active

Die arrangement and method of forming a die arrangement

US8686569B2 · kind B2 · utility

2Cited by

4References

15Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Frank Daeche · Unterhaching, DE
Joachim Mahler · Regensburg, DE
Anton Prueckl · Schierling, DE
Stefan Landau · Usingen, DE
Josef Hoeglauer · Munich, DE

Key dates

Filing date	Dec 14, 2010
Grant date	Apr 1, 2014
Priority date	—
Expiry date	Jan 12, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1815
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A die arrangement includes a carrier having a first side and a second side opposite the first side, the carrier including an opening leading from the first side of the carrier to the second side of the carrier; a first die disposed over the first side of the carrier and electrically contacting the carrier; a second die disposed over the second side of the carrier and electrically contacting the carrier; and an electrical contact structure leading through the opening in the carrier and electrically contacting the second die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.