Thermal interface material, test structure and method of use

US8686749B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Brian M. Erwin · Lagrangeville, US
• David L. Gardell · Saint Albans, US
• James N. Humenik · Lagrangeville, US
• Rajneesh Kumar · Poughkeepsie, US
• John R. Lawson · Pittsford, US

Key dates

• Filing date: Apr 30, 2010
• Grant date: Apr 1, 2014
• Expiry date: Jul 2, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/73253
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Non-corrosive thermal interface materials for use in a test structure and method of use. The test structure includes a heat sink for dissipating heat away from a device under test. The test structure further includes a non-corrosive thermal interface material disposed between the heat sink and the device under test. The non-corrosive thermal interface material is capable of withstanding test conditions for at least 60 minutes for at least 115° C. without staining or leaving residue on the device under test after baking.