Method and apparatus for processing wafer-shaped articles
US8691022B1 · kind B1 · utility
1Cited by
9References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2012 |
| Grant date | Apr 8, 2014 |
| Priority date | — |
| Expiry date | Dec 18, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The wet treatment of wafer-shaped articles is improved by utilizing a droplet generator designed to produce a spray of monodisperse droplets. The droplet generator is mounted above a spin chuck, and is moved across a major surface of the wafer-shaped article in a linear or arcuate path. The droplet generator includes a transducer acoustically coupled to its body such that sonic energy reaches a region of the body surrounding the discharge orifices. Each orifice has a width w of at least 1 μm and at most 200 μm and a height h such that a ratio of h to w is not greater than 1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.