Die fixing method and apparatus

US8691624B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Alexander Ciliox · Greiffenberg, DE
• Georg Borghoff · Warstein, DE
• Torsten Groening · Paderborn, DE
• Karsten Guth · Soest, DE

Key dates

• Filing date: Nov 28, 2011
• Grant date: Apr 8, 2014
• Expiry date: Jan 19, 2032

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T156/1744
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A die fixing method is disclosed which includes providing a substrate having a metallized surface, forming a joining material on the metallized surface and placing a die alignment member with a plurality of openings on the substrate so that portions of the joining material are exposed through the openings. The method further includes placing a plurality of dies in the openings of the die alignment member with a bottom side of each die in contact with part of the joining material and attaching the plurality of dies to the metallized surface of the substrate at an elevated temperature and pressure, the die alignment member withstanding the elevated temperature and pressure. The die alignment member is removed from the substrate after the plurality of dies are attached to the metallized surface of the substrate.