Method of forming a CMOS device with a stressed-channel NMOS transistor and a strained-channel PMOS transistor
US8691644B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 5, 2012 |
| Grant date | Apr 8, 2014 |
| Priority date | — |
| Expiry date | Jul 5, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/0181
Abstract
A method of forming stressed-channel NMOS transistors and strained-channel PMOS transistors forms p-type source and drain regions before an n-type source and drain dopant is implanted and a stress memorization layer is formed, thereby reducing the stress imparted to the n-channel of the PMOS transistors. In addition, a non-conductive layer is formed after the p-type source and drain regions are formed, but before the n-type dopant is implanted. The non-conductive layer allows shallower n-type implants to be realized, and also serves as a buffer layer for the stress memorization layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.