Deborah J. Riley
24Patents
5h-index
31Co-inventors
69Inventor score
Filing activity: Jan 21, 2000 → Mar 14, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7098099B1 | Semiconductor device having optimized shallow junction geometries and method for fabrication thereof | Electricity | 12 | Expired |
| US6492275B2 | Control of transistor performance through adjustment of spacer oxide profile with a wet etch | Electricity | 8 | Expired |
| US8877581B2 | Strain-engineered MOSFETs having rimmed source-drain recesses | Electricity | 6 | Active |
| US7537988B2 | Differential offset spacer | Electricity | 6 | Active |
| US8927385B2 | ZTCR poly resistor in replacement gate flow | Electricity | 5 | Active |
| US7732284B1 | Post high-k dielectric/metal gate clean | Emerging Cross-Sectional Technologies | 5 | Active |
| US8043921B2 | Nitride removal while protecting semiconductor surfaces for forming shallow junctions | Electricity | 4 | Active |
| US8691644B2 | Method of forming a CMOS device with a stressed-channel NMOS transistor and a strained-channel PMOS transistor | Electricity | 3 | Active |
| US9093555B2 | Method of CMOS manufacturing utilizing multi-layer epitaxial hardmask films for improved EPI profile | Electricity | 3 | Active |
| US7371691B2 | Silicon recess improvement through improved post implant resist removal and cleans | Electricity | 2 | Expired |
| US8470707B2 | Silicide method | Electricity | 2 | Active |
| US7323403B2 | Multi-step process for patterning a metal gate electrode | Electricity | 2 | Expired |
| US7384869B2 | Protection of silicon from phosphoric acid using thick chemical oxide | Electricity | 2 | Expired |
| US7569464B2 | Method for manufacturing a semiconductor device having improved across chip implant uniformity | Electricity | 1 | Active |
| US9263444B2 | Devices having inhomogeneous silicide schottky barrier contacts | Electricity | 1 | Active |
| US9385117B2 | NPN heterojunction bipolar transistor in CMOS flow | Electricity | 1 | Active |
| US7132365B2 | Treatment of silicon prior to nickel silicide formation | Electricity | 1 | Expired |
| US10026837B2 | Embedded SiGe process for multi-threshold PMOS transistors | Electricity | 1 | Active |
| US9659825B2 | Method of CMOS manufacturing utilizing multi-layer epitaxial hardmask films for improved epi profile | Electricity | 0 | Active |
| US7422969B2 | Multi-step process for patterning a metal gate electrode | Electricity | 0 | Active |
| US11004612B2 | Low temperature sub-nanometer periodic stack dielectrics | Electricity | 0 | Active |
| US9780001B2 | Devices having inhomogeneous silicide schottky barrier contacts | Electricity | 0 | Active |
| US11417646B2 | NPN heterojunction bipolar transistor in CMOS flow | Electricity | 0 | Active |
| US9224656B2 | Method of CMOS manufacturing utilizing multi-layer epitaxial hardmask films for improved gate spacer control | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.