Method for producing an electronic device
US8698053B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 26, 2007 |
| Grant date | Apr 15, 2014 |
| Priority date | — |
| Expiry date | May 9, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/101
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for producing an electronic device is disclosed. One embodiment provides two soldering partners to be connected to one another at an envisaged joining location and at least one of which includes an electronic component or is formed as such a component, a soldering apparatus having an inductor, and an intermediate plate The soldering partners, the inductor and the intermediate plate are positioned in such a way that the intermediate plate is arranged between the electronic component and the envisaged joining location, on the one hand, and the inductor. The soldering partners are connected at the envisaged joining location by using a solder that is melted by energy emitted by the inductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.