Collimator bonding structure and method
US8698925B2 · kind B2 · utility
3Cited by
10References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2010 |
| Grant date | Apr 15, 2014 |
| Priority date | — |
| Expiry date | Mar 24, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An image sensor is disclosed that includes a solid state semiconductor imager having a metallized catch pad, a collimator having a metallized layer that faces a sensor anode, the metallized layer joined with the metallized catch pad to form a metal bond between the solid state semiconductor imager and the collimator. Methods of making the joined solid state semiconductor imager and collimator assembly are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.