Substrate metallization and ball attach metallurgy with a novel dopant element
US8701281B2 · kind B2 · utility
9Cited by
10References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2009 |
| Grant date | Apr 22, 2014 |
| Priority date | — |
| Expiry date | Oct 10, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49213
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Surface-active dopants are added to a portion of a circuit package before a reflow process to promote wetting and reduce the formation of solder bump bridges. The circuit package has a solder element that electrically connects the circuit package to a substrate. A reflow process is performed to attach the solder element to a pad on the circuit package. During the reflow process, the surface-active dopants diffuse to the surface of the solder element and form an oxide passivation layer on the surface of the solder element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.