Polishing pad with multi-modal distribution of pore diameters
US8702479B2 · kind B2 · utility
29Cited by
5References
42Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2010 |
| Grant date | Apr 22, 2014 |
| Priority date | — |
| Expiry date | Jun 30, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Polishing pads with multi-modal distributions of pore diameters are described. Methods of fabricating polishing pads with multi-modal distributions of pore diameters are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.