Package assembly cleaning process using vaporized solvent
US8702871B2 · kind B2 · utility
0Cited by
2References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2011 |
| Grant date | Apr 22, 2014 |
| Priority date | — |
| Expiry date | May 30, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/8191
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method includes generating a solvent-containing vapor that contains a solvent. The solvent-containing vapor is conducted to a package assembly to clean the package assembly. The solvent-containing vapor condenses to form a liquid on a surface of the package assembly, and flows off from the surface of the package assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.