Structure and manufacturing method for high resolution camera module
US8703519B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2013 |
| Grant date | Apr 22, 2014 |
| Priority date | — |
| Expiry date | Mar 12, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention discloses a structure and a manufacturing method for a high-resolution camera module, wherein the method includes the following steps: providing an image sensor wafer comprising multiple image sensor chips; performing inspection and defining if each image sensor chip is a good chip; disposing an optical cover on the image sensor chip defined as the good chip, wherein the optical cover faces a sensing area and does not cover conductive contacts; cutting the image sensor wafer to obtain the discrete image sensor chip covered with the optical cover; and disposing a first surface of the divided image sensor chip on a bottom surface of a ceramic substrate. The present invention can seal the high resolution camera module during early stage of the manufacturing process to improve the yield rate of the camera module, and downsize the camera module effectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.