Patent · US Active

Semiconductor package structure having an air gap and method for forming

US8704370B2 · kind B2 · utility

1Cited by

2References

20Claims

0Family size

Assignee

Freeescale Semiconductor, Inc. · US

Inventors

Trent S. Uehling · Austin, US
Burton J. Carpenter · Austin, US
Brett P. Wilkerson · Austin, US

Key dates

Filing date	Jun 29, 2012
Grant date	Apr 22, 2014
Priority date	—
Expiry date	Jun 29, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/183
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A package structure includes a package substrate having a top surface and a bottom surface. A semiconductor die having a top surface and a bottom surface. The semiconductor die is mounted to the package substrate. The bottom surface of the semiconductor die is adjacent to the top surface of the package substrate. An air gap is between the bottom surface of the package substrate and the bottom surface of semiconductor die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.