Current sensor including a sintered metal layer
US8704514B2 · kind B2 · utility
1Cited by
13References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2010 |
| Grant date | Apr 22, 2014 |
| Priority date | — |
| Expiry date | Apr 4, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N52/80
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An integrated circuit includes a semiconductor die including a first magnetic field sensor. The integrated circuit includes an isolation material layer over the first magnetic field sensor and a sintered metal layer over the isolation material layer. The first magnetic field sensor is configured to sense a magnetic field generated by a current passing through the sintered metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.