Method for protecting piezoelectric transducer
US8708465B1 · kind B1 · utility
3Cited by
1References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2013 |
| Grant date | Apr 29, 2014 |
| Priority date | — |
| Expiry date | Jan 16, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1623
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Disclosed is a process for preparing an ink jet printhead which comprises: (a) providing a diaphragm plate having a plurality of piezoelectric transducers bonded thereto with an adhesive; (b) placing an encapsulant thin film on the piezoelectric transducers; and (c) applying heat, pressure, or a combination thereof to the encapsulant thin film to a degree sufficient to cause the encapsulant to encapsulate the adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.