Method of manufacturing chemical mechanical polishing layers
US8709114B2 · kind B2 · utility
27Cited by
4References
10Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 22, 2012 |
| Grant date | Apr 29, 2014 |
| Priority date | — |
| Expiry date | Oct 31, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/0009
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing polishing layers for use in chemical mechanical polishing pads is provided, wherein a plurality of polishing layers are derived from a cake, wherein the formation of density defects in the cake and the surface roughness of the polishing layers formed are minimized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.