Substrate and patterning device for use in metrology, metrology method and device manufacturing method
US8709687B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2012 |
| Grant date | Apr 29, 2014 |
| Priority date | — |
| Expiry date | Apr 21, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A pattern from a patterning device is applied to a substrate by a lithographic apparatus. The applied pattern includes product features and metrology targets. The metrology targets include large targets and small targets which are for measuring overlay. Some of the smaller targets are distributed at locations between the larger targets, while other small targets are placed at the same locations as a large target. By comparing values measured using a small target and large target at the same location, parameter values measured using all the small targets can be corrected for better accuracy. The large targets can be located primarily within scribe lanes while the small targets are distributed within product areas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.