Integrated circuit packaging system with heat slug and method of manufacture thereof
US8710640B2 · kind B2 · utility
4Cited by
3References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2011 |
| Grant date | Apr 29, 2014 |
| Priority date | — |
| Expiry date | Jan 21, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit over a package carrier; mounting a conductive connector over the package carrier; forming an encapsulation over the integrated circuit, the encapsulation having a recess exposing the conductive connector; and mounting a heat slug over the encapsulation, the heat slug having an opening with an opening width greater than a recess width of the recess, the opening exposing a portion of a top surface of the encapsulation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.