Method for detaching and removing a semiconductor chip from a foil
US8715457B2 · kind B2 · utility
2Cited by
9References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 3, 2009 |
| Grant date | May 6, 2014 |
| Priority date | — |
| Expiry date | Apr 18, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1983
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The detachment and removal of a semiconductor chip from a foil occurs in accordance with the invention in three phases. In the first phase there is a partial detachment of the semiconductor chip from the foil with mechanical means, but without the participation of a chip gripper. In the second phase the semiconductor chip is further detached from the foil, with the semiconductor chip being held by the chip gripper. In the third phase the chip gripper is lifted and moved away.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.