Semiconductor device employing aluminum alloy lead-frame with anodized aluminum
US8716069B2 · kind B2 · utility
1Cited by
8References
9Claims
0Family size
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Key dates
| Filing date | Sep 28, 2012 |
| Grant date | May 6, 2014 |
| Priority date | — |
| Expiry date | Sep 28, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49172
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device comprises an aluminum alloy lead-frame with a passivation layer covering an exposed portion of the aluminum alloy lead-frame. Since aluminum alloy is a low-cost material, and its hardness and flexibility are suitable for deformation process, such as punching, bending, molding and the like, aluminum alloy lead frame is suitable for mass production; furthermore, since its weight is much lower than copper or iron-nickel material, aluminum alloy lead frame is very convenient for the production of semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.