Patent · US Active

Enhanced flip chip package

US8716859B2 · kind B2 · utility

17Cited by

2References

13Claims

0Family size

Assignee

Intel Mobile Communications GmbH · DE

Inventors

Thorsten Meyer · Regensburg, DE
Gerald Ofner · Regensburg, DE
Bernd Waidhas · Nittendorf, DE

Key dates

Filing date	Jan 10, 2012
Grant date	May 6, 2014
Priority date	—
Expiry date	Jan 19, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3511
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A flip chip package structure is proposed in which a redistribution layer (RDL) is disposed on a surface of both a semiconductor chip and one or more lateral extensions of the semiconductor chip surface. The lateral extensions may be made using, e.g., a reconstituted wafer to implement a fanout region lateral to one or more sides of the semiconductor chip. One or more electrical connectors such as solder bumps or copper cylinders may be applied to the RDL, and an interposer such as a PCB interposer may be connected to the electrical connectors. In this way, a relatively tight semiconductor pad pitch may be accommodated and translated to an appropriate circuit board pitch without necessarily requiring a silicon or glass interposer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.