Method of assembling semiconductor device including insulating substrate and heat sink
US8722465B1 · kind B1 · utility
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11References
10Claims
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Assignee
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Key dates
| Filing date | Jan 14, 2014 |
| Grant date | May 13, 2014 |
| Priority date | — |
| Expiry date | Jan 14, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor dies are mounted on a heat sink array frame structure. The heat sink array frame structure and the semiconductor dies are assembled together with an insulating substrate that has a corresponding array of apertures on an adhesive tape. The semiconductor dies are connected electrically with electrical contacts on the insulating substrate. The semiconductor dies, heat sinks and electrical connections to the contacts are encapsulated with a mold compound and then the encapsulated array is de-taped and singulated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.