Junhua Luo
7Patents
0h-index
10Co-inventors
31Inventor score
Filing activity: Jan 11, 2011 → Aug 14, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9093438B2 | Semiconductor device package with cap element | Electricity | 0 | Active |
| US8481369B2 | Method of making semiconductor package with improved standoff | Electricity | 0 | Active |
| US10005675B2 | Li4Sr(BO3)2 compound, Li4Sr(BO3)2 nonlinear optical crystal, preparation method and use thereof | Chemistry; Metallurgy | 0 | Active |
| US8859336B2 | Method of packaging semiconductor die with cap element | Electricity | 0 | Active |
| US8836105B2 | Semiconductor device package with cap element | Electricity | 0 | Active |
| US8722465B1 | Method of assembling semiconductor device including insulating substrate and heat sink | Electricity | 0 | Active |
| US8643170B2 | Method of assembling semiconductor device including insulating substrate and heat sink | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.