Saw filter having planar barrier layer and method of making
US8723392B2 · kind B2 · utility
1Cited by
18References
13Claims
0Family size
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Key dates
| Filing date | Jul 15, 2011 |
| Grant date | May 13, 2014 |
| Priority date | — |
| Expiry date | Jan 10, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a surface acoustic wave (SAW) filter and method of making the same. The SAW filter includes a piezoelectric substrate; a planar barrier layer disposed above the piezoelectric substrate, and at least one conductor buried in the piezoelectric substrate and the planar barrier layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.