Positive displacement pumping chamber
US8728337B2 · kind B2 · utility
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4Claims
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Assignee
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Key dates
| Filing date | Feb 22, 2013 |
| Grant date | May 20, 2014 |
| Priority date | — |
| Expiry date | Feb 22, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67207
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method is for processing a substrate. The method includes placing the substrate in a process volume and introducing a process gas or vapor into the process volume and/or subsequently removing gas or vapor from the volume. The step of introducing and/or removing the gas is at least partially performed by moving a movable wall to change the process volume in an appropriate sense.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.