Method and system for wafer registration
US8731274B2 · kind B2 · utility
2Cited by
13References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2011 |
| Grant date | May 20, 2014 |
| Priority date | — |
| Expiry date | Nov 4, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for wafer registration, the method may include: moving a wafer by an X-Y stage and acquiring wafer edge area images; and processing the wafer edge area images to locate an edge of the wafer. A system that includes a camera, an X-Y stage for moving a wafer; wherein the camera is arranged to acquire wafer edge area images; and a processor that is arranged to process the wafer edge area images to locate an edge of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.