Life enhancement of ring assembly in semiconductor manufacturing chambers
US8740206B2 · kind B2 · utility
3Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2011 |
| Grant date | Jun 3, 2014 |
| Priority date | — |
| Expiry date | May 6, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6831
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention generally relates to a ring assembly that may be used in an etching or other plasma processing chamber. The ring assembly generally includes an inner ring and an outer ring disposed radially outward of the inner ring. The inner ring will correspond to the location where the majority of erosion occurs during use. This inner ring can be flipped and reused until both sides have eroded beyond their service life. Collectively, the two rings generally have the shape of a single piece ring, but the service life of the ring assembly is longer than a conventional single piece ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.