Patent · US Active

Diode array and method for producing a diode array

US8742571B2 · kind B2 · utility

0Cited by

3References

10Claims

0Family size

Assignee

Pac Tech—Packaging Technologies Gmbh · DE

Inventors

Elke Zakel · Falkensee, DE
Thorsten Teutsch · Berlin, DE
Ghassem Azdasht · Berlin, DE
Siavash Tabrizi · Berlin, DE

Key dates

Filing date	Sep 15, 2010
Grant date	Jun 3, 2014
Priority date	—
Expiry date	Dec 11, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/12042
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A diode arrangement includes a diode and two electrodes. Each electrode is connected to the diode in an electrically conductive manner via a soldered connection on one of two oppositely arranged contact surfaces of the diode. The contact surfaces of the diode are formed substantially by the surfaces of a lower side and an upper side of the diode and are contacted with the contact extensions of the electrodes via the soldered connection. The contact extensions forming counter contact surfaces are substantially congruent with the contact surfaces of the diode.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.