Vertical electrical interconnect formed on support prior to die mount

US8742602B2 · kind B2 · utility

Assignee

• Invensas LLC · US

Inventors

• Terrence Caskey · Santa Cruz, US
• Lawrence Douglas Andrews, JR. · Soquel, US
• Scott McGrath · Scotts Valley, US
• Simon J. S. McElrea · Scotts Valley, US
• Yong Du · Timonium, US
• Mark A. Scott · Uxbridge, GB

Key dates

• Filing date: Mar 12, 2008
• Grant date: Jun 3, 2014
• Expiry date: Jul 30, 2028

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/14
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A die assembly includes a die mounted to a support, in which the support has interconnect pedestals formed at bond pads, and the die has interconnect terminals projecting beyond a die edge into corresponding pedestals. Also, a support has interconnect pedestals. Also, a method for electrically interconnecting a die to a support includes providing a support having interconnect pedestals formed at bond pads on the die mount surface of the support, providing a die having interconnect terminals projecting beyond a die edge, positioning the die in relation to the support such that the terminals are aligned with the corresponding pedestals, and moving the die and the support toward one another so that the terminals contact the respective pedestals.