Scott McGrath
21Patents
6h-index
47Co-inventors
65Inventor score
Filing activity: Mar 12, 2008 → Apr 29, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7923349B2 | Wafer level surface passivation of stackable integrated circuit chips | Electricity | 31 | Active |
| US8376051B2 | System and method for providing additional blowout preventer control redundancy | Emerging Cross-Sectional Technologies | 30 | Active |
| US8723332B2 | Electrically interconnected stacked die assemblies | Electricity | 28 | Active |
| US8629543B2 | Electrically interconnected stacked die assemblies | Electricity | 15 | Active |
| US8704379B2 | Semiconductor die mount by conformal die coating | Electricity | 12 | Active |
| US8684092B2 | System and method for providing additional blowout preventer control redundancy | Emerging Cross-Sectional Technologies | 10 | Active |
| US9153517B2 | Electrical connector between die pad and z-interconnect for stacked die assemblies | Electricity | 3 | Active |
| US10062099B2 | Product identification based on location associated with image of product | Physics | 3 | Active |
| US10254386B1 | Waveform model | Electricity | 2 | Active |
| US8912661B2 | Stacked die assembly having reduced stress electrical interconnects | Electricity | 2 | Active |
| US9508689B2 | Electrical connector between die pad and z-interconnect for stacked die assemblies | Electricity | 2 | Active |
| US9825002B2 | Flipped die stack | Electricity | 1 | Active |
| US9252116B2 | Semiconductor die mount by conformal die coating | Electricity | 1 | Active |
| US9824999B2 | Semiconductor die mount by conformal die coating | Electricity | 1 | Active |
| US9503915B2 | Dynamic beamforming configuration based on network conditions | Electricity | 1 | Active |
| US9438496B2 | Monitoring link quality between network devices | Electricity | 1 | Active |
| US8324081B2 | Wafer level surface passivation of stackable integrated circuit chips | Electricity | 1 | Active |
| US8742602B2 | Vertical electrical interconnect formed on support prior to die mount | Electricity | 0 | Active |
| US9659848B1 | Stiffened wires for offset BVA | Electricity | 0 | Active |
| US9859234B2 | Methods and structures to repair device warpage | Electricity | 0 | Active |
| US11549681B2 | Water heater and boiler processes | Mechanical Engineering; Lighting; Heating | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.