Semiconductor devices and methods of manufacture thereof
US8748257B2 · kind B2 · utility
0Cited by
1References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 4, 2011 |
| Grant date | Jun 10, 2014 |
| Priority date | — |
| Expiry date | Apr 13, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/716
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Capacitor plates, capacitors, semiconductor devices, and methods of manufacture thereof are disclosed. In one embodiment, a capacitor plate includes at least one via and at least one conductive member coupled to the at least one via. The at least one conductive member comprises an enlarged region proximate the at least one via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.