Enhanced confinement of sensitive materials of a high-K metal gate electrode structure
US8748281B2 · kind B2 · utility
4Cited by
2References
1Claims
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Key dates
| Filing date | Oct 19, 2010 |
| Grant date | Jun 10, 2014 |
| Priority date | — |
| Expiry date | Jan 1, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/0133
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
When forming sophisticated high-k metal gate electrode structures, the removal of a dielectric cap material may be accomplished with superior process uniformity by using a silicon dioxide material. In other illustrative embodiments, an enhanced spacer regime may be applied, thereby also providing superior implantation conditions for forming drain and source extension regions and drain and source regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.