Patent · US Active

Enhanced confinement of sensitive materials of a high-K metal gate electrode structure

US8748281B2 · kind B2 · utility

4Cited by
2References
1Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 19, 2010
Grant dateJun 10, 2014
Priority date
Expiry dateJan 1, 2032

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D84/0133
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

When forming sophisticated high-k metal gate electrode structures, the removal of a dielectric cap material may be accomplished with superior process uniformity by using a silicon dioxide material. In other illustrative embodiments, an enhanced spacer regime may be applied, thereby also providing superior implantation conditions for forming drain and source extension regions and drain and source regions.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.