Structure for inspecting defects in word line array fabricated by SADP process and method thereof
US8748814B1 · kind B1 · utility
61Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2013 |
| Grant date | Jun 10, 2014 |
| Priority date | — |
| Expiry date | Mar 14, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2817
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
This invention provides a test structure for inspecting word line array fabricated by SADP process, wherein the test structure comprises a contour circuit to cover one end of the WL array, and is alternatively float and ground to the word line array. The word line array then can be inspected by using E-beam inspection tool to identify open and short defects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.