Patent · US Active

Sensor module

US8748998B2 · kind B2 · utility

5Cited by

2References

8Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Jens Frey · Echterdingen, DE
Heribert Weber · Leverkusen, DE
Eckhard Graf · Gomaringen, DE

Key dates

Filing date	Aug 9, 2011
Grant date	Jun 10, 2014
Priority date	—
Expiry date	Sep 20, 2031

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C2203/035
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A sensor module includes a substrate system which has multiple substrates situated one on top of the other and connected in each case via a wafer bond connection. The substrate system includes at least one first sensor substrate and at least one second sensor substrate, the first sensor substrate having a first sensor structure and the second sensor substrate having a second sensor structure. The first and second sensor structures are designed for detecting different characteristics. At least the first sensor structure includes a micromechanical functional structure. Moreover, a method for manufacturing such a sensor module is disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.