Patent · US Active

Package including an interposer having at least one topological feature

US8749074B2 · kind B2 · utility

2Cited by

5References

16Claims

0Family size

Assignee

Micron Technology, Inc. · US

Inventors

Steven Eskildsen · Boise, US
Aravind Ramamoorthy · Roseville, US

Key dates

Filing date	Nov 30, 2009
Grant date	Jun 10, 2014
Priority date	—
Expiry date	Nov 27, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, having an interposer including at least one topological feature, such as a depression in a surface of the interposer, a die coupled to the surface of the interposer, and an encapsulant material formed over the die and the interposer, and disposed in the at least one depression to resist movement of the encapsulant material relative to the interposer. Other embodiments may be described and claimed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.