Electronic packaging with a variable thickness mold cap
US8753926B2 · kind B2 · utility
2Cited by
18References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2010 |
| Grant date | Jun 17, 2014 |
| Priority date | — |
| Expiry date | Sep 14, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package with improved warpage compensation. The electronic package includes a mold cap having a variable thickness. The variable thickness can have a mound or dimple design. In another embodiment, a method is provided for reducing unit warpage of an electronic package by designing the topography of a mold cap to compensate for warpage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.