Gopal C. Jha
3Patents
2h-index
3Co-inventors
30Inventor score
Filing activity: Aug 24, 2010 → Feb 26, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8546921B2 | Hybrid multilayer substrate | Electricity | 2 | Active |
| US8753926B2 | Electronic packaging with a variable thickness mold cap | Electricity | 2 | Active |
| US9313881B2 | Through mold via relief gutter on molded laser package (MLP) packages | Emerging Cross-Sectional Technologies | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.