Devices and methods for configuring conductive elements for a semiconductor package
US8754518B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2013 |
| Grant date | Jun 17, 2014 |
| Priority date | — |
| Expiry date | Jan 22, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a package substrate having a plurality of conductive elements, each of the conductive elements including a conductive trace and a bond finger positioned at an end of the conductive trace. The bond fingers can be arranged on the package substrate in at least three groups. A first group of the three groups can include a first number of the bond fingers. A third group of the three groups can include a third number of the bond fingers. A second group of the three groups can include an intermediate number of the bond fingers. The intermediate number is between the first and the third numbers. Spacing between the conductive elements along the length of the conductive elements is approximately the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.