Semiconductor device assembly having a heat spreader
US8754521B1 · kind B1 · utility
3Cited by
7References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2013 |
| Grant date | Jun 17, 2014 |
| Priority date | — |
| Expiry date | Mar 13, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaged semiconductor device includes a package substrate, a semiconductor die on the package substrate, an encapsulant over the semiconductor die and package substrate, and a heat spreader having a pedestal portion and an outer portion surrounding the pedestal portion. The encapsulant includes an opening within a perimeter of the semiconductor die. The bottom surface of the pedestal portion of the heat spreader faces the top surface of the semiconductor die, wherein a first portion of the opening and at least a portion of the encapsulant is between the bottom surface of the pedestal portion and the semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.