Treatment of a substrate with a liquid medium

US8759230B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Stephan Bradl · Regensburg, DE
• Michael Melzl · Neutraubling, DE
• Josef Schwaiger · Teugn, DE
• Thilo Stache · Regensburg, DE

Key dates

• Filing date: Dec 9, 2008
• Grant date: Jun 24, 2014
• Expiry date: Mar 15, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/6835
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention relates to an arrangement of electronic semiconductor components on a carrier system for treating the semiconductor components with a liquid medium. A semiconductor component is detachably mounted on the carrier system with the active side thereof in such a way that the arrangement comprises a gap at least in the edge region and partially between the semiconductor components and the carrier system. The aim of the invention is to provide a detachable arrangement of electronic semiconductor components on a mechanically stable carrier system for safely handling the semiconductor components during the production process, wherein the capillarity of the gap between the semiconductor components and the carrier system is reduced in a controlled manner, thus preventing the damaging effect of a liquid medium seeping into the gap. To this end, the surface of the carrier system is shaped in such a way that the gap is widened along the entire edge region thereof.