Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package
US8766457B2 · kind B2 · utility
1Cited by
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19Claims
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Key dates
| Filing date | Nov 29, 2011 |
| Grant date | Jul 1, 2014 |
| Priority date | — |
| Expiry date | Dec 30, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bonding structure of a semiconductor package includes: a first conductive member configured to transmit an electrical signal; and a bonding pad configured to be electrically coupled to a surface of the first conductive member and comprising a plurality of sub bonding pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.