Low sloped edge ring for plasma processing chamber
US8771423B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2012 |
| Grant date | Jul 8, 2014 |
| Priority date | — |
| Expiry date | Oct 23, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68757
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of a cover ring for use in a plasma processing chamber are provided. In one embodiment, a cover ring for use in a plasma processing chamber includes a ring-shaped body fabricated from a yttrium (Y) containing material. The body includes a bottom surface having an inner locating ring and an outer locating ring. The inner locating ring extends further from the body than the outer locating ring. The body includes an inner diameter wall having a main wall and a secondary wall separated by a substantially horizontal land. The body also includes a top surface having an outer sloped top surface meeting an inner sloped surface at an apex. The inner sloped surface defines an angle with a line perpendicular to a centerline of the body less than about 70 degrees.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.