Inventor · Campbell, CA, US

Michael D. Willwerth

51Patents
8h-index
96Co-inventors
81Inventor score

Filing activity: Dec 23, 2003 → Apr 25, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US8270141B2 Electrostatic chuck with reduced arcing Emerging Cross-Sectional Technologies 23 Active
US8349128B2 Method and apparatus for stable plasma processing Electricity 20 Active
US8075728B2 Gas flow equalizer plate suitable for use in a substrate process chamber Electricity 20 Active
US7777152B2 High AC current high RF power AC-RF decoupling filter for plasma reactor heated electrostatic chuck Electricity 20 Active
US9275887B2 Substrate processing with rapid temperature gradient control Performing Operations; Transporting 17 Active
USD931240S1 Substrate support pedestal General 14 Active
US7158221B2 Method and apparatus for performing limited area spectral analysis Electricity 11 Expired
US7832354B2 Cathode liner with wafer edge gas injection in a plasma reactor chamber Electricity 9 Active
US8287650B2 Low sloped edge ring for plasma processing chamber Electricity 8 Active
US8840725B2 Chamber with uniform flow and plasma distribution Electricity 6 Active
US9883549B2 Substrate support assembly having rapid temperature control Performing Operations; Transporting 6 Active
US8419893B2 Shielded lid heater assembly Electricity 5 Active
US7330244B2 Method and apparatus for performing limited area spectral analysis Electricity 4 Active
US10257887B2 Substrate support assembly Performing Operations; Transporting 4 Active
US10283397B2 Substrate lift pin actuator Electricity 4 Active
US8501626B2 Methods for high temperature etching a high-K material gate structure Electricity 3 Active
US9761416B2 Apparatus and methods for reducing particles in semiconductor process chambers Emerging Cross-Sectional Technologies 3 Active
US8299391B2 Field enhanced inductively coupled plasma (Fe-ICP) reactor Electricity 3 Active
US10790180B2 Electrostatic chuck with variable pixelated magnetic field Electricity 3 Active
US7879250B2 Method of processing a workpiece in a plasma reactor with independent wafer edge process gas injection Electricity 2 Active
US8757603B2 Low force substrate lift Electricity 2 Active
US8383002B2 Method of processing a workpiece in a plasma reactor with independent wafer edge process gas injection Electricity 2 Active
US8771423B2 Low sloped edge ring for plasma processing chamber Electricity 2 Active
US10460968B2 Electrostatic chuck with variable pixelated magnetic field Electricity 1 Active
US10490435B2 Cooling element for an electrostatic chuck assembly Emerging Cross-Sectional Technologies 1 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.