Overmold with single attachment using optical film
US8779443B2 · kind B2 · utility
4Cited by
1References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2012 |
| Grant date | Jul 15, 2014 |
| Priority date | — |
| Expiry date | Sep 27, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor package is provided having a light sensitive component and a light emitting component attached to a same substrate. Light from the light emitting component is emitted from the package through a first opening and reflected back into the package to the light sensitive component through a second opening in the package. A glass attachment is placed between the light emitting component and the light sensitive component. A portion of the glass is removed and filled with an opaque substance to prevent light travelling between the light emitting component and the light sensitive component in the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.