Hk Looi
7Patents
3h-index
14Co-inventors
43Inventor score
Filing activity: Dec 22, 2011 → Oct 10, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8492181B2 | Embedded wafer level optical package structure and manufacturing method | Electricity | 7 | Active |
| US9105766B2 | Optical electronic package | Electricity | 5 | Active |
| US8779443B2 | Overmold with single attachment using optical film | Electricity | 4 | Active |
| US9003644B2 | PNP apparatus and PNP tool head with direct bonding pressure pick-up tip | Emerging Cross-Sectional Technologies | 1 | Active |
| US9025339B2 | Adhesive dam | Emerging Cross-Sectional Technologies | 0 | Active |
| US9244334B2 | Contact having an angled portion | Emerging Cross-Sectional Technologies | 0 | Active |
| US9671671B2 | Optical assembly including electrically conductive coupling member and related methods | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.