Patent · US Active

Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips

US8779563B2 · kind B2 · utility

3Cited by

11References

11Claims

0Family size

Assignee

Intel Mobile Communications GmbH · DE

Inventors

Markus Brunnbauer · Lappersdorf, DE
Thorsten Meyer · Regensburg, DE
Stephan Brandl · Salzweg, DE
Ralf Plieninger · Poing, DE
Jens Pohl · San Luis Obispo, US
Klaus Pressel · Regensburg, DE
Recai Sezi · Simmerath, DE

Key dates

Filing date	Nov 9, 2012
Grant date	Jul 15, 2014
Priority date	—
Expiry date	Nov 9, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A workpiece has at least two semiconductor chips, each semiconductor chip having a first main surface, which is at least partially exposed, and a second main surface. The workpiece also comprises an electrically conducting layer, arranged on the at least two semiconductor chips, the electrically conducting layer being arranged at least on regions of the second main surface, and a molding compound, arranged on the electrically conducting layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.