Patent · US Active

Semiconductor chip comprising a plurality of contact pads and a plurality of associated pad cells

US8779577B2 · kind B2 · utility

1Cited by

1References

19Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Peter Ossimitz · Munich, DE
Matthias Van Daak · Borgo San Lazzaro, DE
Dirk Hesidenz · Sauerlach, DE

Key dates

Filing date	Feb 13, 2012
Grant date	Jul 15, 2014
Priority date	—
Expiry date	Feb 13, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3011
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor chip includes a plurality of contact pads, which are arranged in an edge area on a surface of the semiconductor chip. In a semiconductor area of the semiconductor chip, every contact pad of the plurality of contact pads has an associated pad cell provided, which includes at least one of a driver or a receiver and is configured to drive output signals or receive input signals on its associated contact pad, if the driver or receiver is connected to the contact pad. Additionally, for a contact pad which is used as a supply contact pad, the driver or receiver of the associated pad cell is not connected to the contact pad or any other contact pad for driving output signals or receiving input signals on the same.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.