Heat processing apparatus and heat processing method
US8782918B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2011 |
| Grant date | Jul 22, 2014 |
| Priority date | — |
| Expiry date | Mar 28, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/677
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat processing apparatus includes a heating plate configured to heat the substrate; a cover configured to surround a space above the heating plate; an exhaust gas flow forming mechanism configured to exhaust gas inside the cover to form exhaust gas flows within the space above the heating plate; a downflow forming mechanism configured to form downflows uniformly supplied onto an upper surface of the substrate placed on the heating plate; and a control mechanism configured to execute mode switching control between a mode arranged to heat the substrate while forming the downflows by the downflow forming mechanism and a mode arranged to heat the substrate while forming the exhaust gas flows by the exhaust gas flow forming mechanism.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.